The Tiny Core Module TCM-BF537 is optimized for performance and size. The module integrates processor, RAM, flash and power supply at a size of 28 x 28mm! It is based at the high performance ADSP-BF537 from Analog Devices. The Core Module is available for industrial temperature range. It addresses 32 MByte SDRAM via its 16 bit wide SDRAM bus and has an on-board NOR-flash of 8 MByte.
Highlights ADSP BF537 DSP 32 MByte SD RAM up to 133 Mhz 64 MByte Flash Very small design (28 x 28 mm) Ethernet physical on-board Border Pad Industrial Core Module (-40 to +85°C)
Typical Applications BLACKSheep® OS, uClinux
Automation and control systems, Mobile Communication, Smart Mobile Devices, Aerospace and Defense, Security and Alarms Systems , Health Care Equipment and Devices, Handheld Medical/Industrial, Test and Measurement , Robotic, Automotive,
Package contents TCM-BF537 Industrial| CPU | |
|---|---|
| CPU | ADSP BF537 |
| Crystal | 25 MHz |
| General Information | |
| Clock | 500 MHz |
| Temperature Range | 85 °C |
| Weight | 4 g |
| Width | 28 mm |
| Height | 28 mm |
| Memory | |
| RAM | 32 MByte SD-RAM |
| Flash | 64 MByte |
| Interfaces | |
| Communication | 1 x ETH (10/100 MBit, external Physical Chip required) , 1 x CAN , 1 x SPI , 1 x PPI (16 bit) , 2 x UART , 1 x SPORT , 1 x I²C |
Single 3.3V Supply voltage On-Board core voltage regulator Low voltage reset circuit Connector and Ball Grid Array (BGA) versions available
