Embedded World 2023

[Translate to EN:] BECOM @Embedded World 2023
[Translate to EN:] BECOM @Embedded World 2023
Last week the Embedded World took place in Nuremberg.

Our well-rehearsed exhibition team showed the latest developments of embedded systems with 3D Time-of-Flight technology:

  • Depth Sensor Solutions
  • image processing
  • embedded vision
  • multi-camera systems
  • Edge computing
  • Deep Learning & AI

A highlight was certainly the visual presentation of our booth in 3D by our multi-camera systems as well as a LIVE lecture on the topic of "multi-sensor applications" by our Senior Business Development Manager, Mag.(FH) Tia Maria Troch.

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