Modern industrial automation is shaped by Industry 4.0. Production processes are becoming increasingly flexible, machines communicate autonomously with one another, and data streams merge in real time. This transformation calls for electronic components that are not only intelligent and connected but, above all, designed for maximum uptime. Downtime on an automated production line can result in substantial costs, making reliability the top priority.
As an experienced technology and EMS partner, BECOM supports machine builders, system integrators and automation specialists throughout this transformation. We accompany you from the initial hardware and software concept through targeted industrialisation to high-precision series production. With our electronics solutions, we help ensure that your systems operate safely, reliably and efficiently.
Electronics used in industrial environments must withstand demanding conditions, from electromagnetic interference caused by high-power drives to continuous operation. BECOM combines in-depth development expertise with advanced manufacturing technology.
Our engineering teams develop robust, future-ready hardware designs for industrial applications. In parallel, we develop the corresponding real-time embedded software. We ensure the seamless integration of microcontrollers and computing platforms to precisely control complex automation processes.
Industry 4.0 is driven by data exchange. We have extensive expertise in integrating modern industrial communication interfaces and bus systems. This creates the technical foundation for fast, secure and deterministic data transmission between controllers, sensors and actuators.
Our manufacturing and development capabilities cover the full spectrum of modern production and logistics systems. We develop and manufacture electronic assemblies for the following key areas:
PLC-Related Electronics & Industrial Communication: Intelligent I/O modules, communication modules and interface cards for programmable logic controllers.
Robotics & Motion Control: High-precision control and power electronics for industrial robots, servo drives and complex axis control systems.
Automated Guided Vehicles (AGVs): Robust electronic components for automated and autonomous logistics vehicles used in intralogistics.
HMI Systems (Human-Machine Interfaces): Intuitive and robust operator panels, touch displays and display units for machine operation directly on the shop floor.
Smart Sensor Technology: High-precision sensor electronics for capturing process data, position, pressure and temperature in industrial environments.
The industrial shop floor is a demanding environment. Dust, oil mist, moisture and continuous vibration can place significant stress on electronic hardware. At our state-of-the-art European production facilities, we use specialised manufacturing processes to provide long-term protection for your electronics:
We manufacture complex high-density assemblies on our SMT lines just as reliably as heavy, mechanically demanding components – such as those used in power supplies or relays – in our automated THT production using selective and wave soldering processes.
Fully automated conformal coating and complete potting processes reliably protect sensitive printed circuit boards from contamination, chemical exposure and moisture.
We integrate your electronics directly into customer-specific enclosures, manufacture cable assemblies and deliver complete, control-cabinet-ready systems from a single source.
To support high availability in continuous 24/7 operation, every electronic assembly at BECOM undergoes a strictly defined, multi-stage 3D inspection process directly within the production line.
3D SPI (Solder Paste Inspection): Three-dimensional inspection of solder paste deposits to detect potential soldering defects before component placement.
3D AOI (Automated Optical Inspection): High-resolution optical inspection of component placement, polarity and solder joint geometry in three dimensions.
3D X-Ray Inspection: Non-destructive AXI inspection for reliable quality assessment of hidden solder joints beneath critical components such as BGAs and QFNs.
ICT / Flying Probe: Comprehensive electrical in-circuit testing to verify all conductive paths and component values.
EOL / Functional Testing (End-of-Line): Final, comprehensive functional testing of the complete system under real operating conditions, including precise test documentation.
Calibration: Precise adjustment and software calibration of integrated measurement and sensor components to ensure high and reproducible process accuracy in subsequent operation.
Short development cycles require fast testing processes. Because we understand how time-consuming external testing can be, BECOM operates its own fully equipped testing and validation laboratory. This helps safeguard your investment and bring your products to market faster:
EMC Testing: Testing for electromagnetic compatibility in accordance with stringent industrial standards (CE conformity) directly during the development phase.
Thermal Shock & Environmental Testing: Simulation of severe temperature changes and humidity to verify long-term stability.
Vibration & Mechanical Shock: Stress testing using shaker systems for continuous operation on vibrating machinery and motors.