The global mobility industry is undergoing the most profound and dynamic transformation in its history. Today’s major trends – from the widespread electrification of powertrains and advancing digitalisation to autonomous driving and intelligent IoT connectivity – are redefining road vehicles, rail systems and marine applications. Electronic components are no longer merely supporting elements; they form the central nervous system of modern mobility concepts.
As an internationally experienced EMS provider (Electronic Manufacturing Services), BECOM develops and manufactures highly reliable electronics solutions for demanding applications in harsh environments. We see ourselves not merely as a manufacturing service provider, but as a strategic technology partner. We support you throughout the entire product lifecycle – from the initial concept study and certified series production through to long-term obsolescence management.
Safety-critical electronics in the mobility sector leave no room for error. BECOM combines in-depth development expertise with advanced manufacturing technologies to deliver high performance under demanding operating conditions.
Our engineering teams develop future-ready system architectures. Our expertise covers both precise hardware development for complex circuit designs and the development of stable, real-time embedded software. From microcontroller-based control systems to highly integrated computing platforms, we bring your mobility concepts to life.
Safety is non-negotiable in modern mobility. We develop and manufacture in accordance with stringent functional safety requirements, including standards such as ISO 26262 for automotive applications up to ASIL D and IEC 61508 / EN 50128 for railway applications up to SIL 4. As connected systems increasingly become targets for cyber threats, we integrate advanced embedded security concepts from the outset to help protect systems against external attacks.
Our development processes are aligned with internationally recognised automotive maturity models. By consistently following Automotive SPICE (ASPICE), we ensure a high level of transparency, end-to-end documentation and reproducible quality throughout every phase of software and systems engineering.
Every market has its own regulations, standards and physical challenges. BECOM provides specialised electronics manufacturing solutions tailored to the specific requirements of road, rail and marine applications.
Our development and manufacturing capabilities cover the full spectrum of modern automotive, rail and micromobility systems. We develop and manufacture electronic assemblies for the following key areas:
Telematics, Infotainment & V2X: Highly reliable communication modules, connectivity platforms and antenna systems for fleet management, vehicle tracking and intelligent Vehicle-to-Everything (V2X) data exchange.
Battery Management & Power Electronics: Intelligent BMS boards for precise cell monitoring, highly efficient DC/DC converters and control units for electrified powertrains in hybrid and electric vehicles.
Smart Lighting Systems & Vision Sensors: Electronic assemblies for adaptive, high-resolution LED headlights, camera-based digital mirror systems and sensor solutions for advanced driver assistance systems (ADAS).
Rail Vehicles & Railway Infrastructure: Extremely robust, vibration-resistant electronic components for signalling technology, train protection systems, point control systems and modern passenger information systems in rail transport.
Micromobility & Urban Transport: Compact motor controllers, battery solutions and IoT nodes for e-bikes, e-scooters and urban shared mobility fleets.
To ensure consistently high and reproducible series quality, every electronic assembly at BECOM undergoes a multi-stage, high-precision inspection process directly within the production line. Using advanced testing and measurement methods, we help ensure the reliable performance and long-term durability of your mobility electronics throughout the entire product lifecycle:
3D SPI (Solder Paste Inspection): Three-dimensional inspection of solder paste deposits to detect potential soldering defects before component placement.
3D AOI (Automated Optical Inspection): High-resolution optical inspection of component placement, polarity and solder joint geometry in three dimensions.
3D X-Ray Inspection: Non-destructive AXI inspection for reliable quality assessment of hidden solder joints beneath highly integrated wireless and processor components.
ICT / Flying Probe: Comprehensive electrical in-circuit testing for complete verification of all conductive paths and component values.
EOL / Functional Testing (End-of-Line): Final, comprehensive functional testing of the complete system, including specific radio-frequency (RF) testing of the wireless interfaces.
Calibration: Precise adjustment and software calibration of integrated measurement and sensor components to ensure high accuracy in subsequent operation.
As early as the prototype stage, we simulate the demanding lifecycle conditions your products may encounter. Our laboratory services include:
EMC Testing: Electromagnetic compatibility testing in accordance with specific automotive and industrial standards.
Thermal Shock & Environmental Testing: Simulation of extreme temperature changes from -40 °C to +150 °C and varying humidity conditions.
Vibration & Mechanical Shock: Stress testing for demanding applications on rail and road.
Non-Destructive Testing: Advanced 3D X-ray inspection (AXI) and automated optical inspection (AOI) help ensure high and reproducible manufacturing quality.