From access control and video surveillance to alarm systems and intelligent sensors, modern security systems place extremely high demands on reliability, availability and service life. The security industry is evolving rapidly: new technologies such as artificial intelligence (AI), edge computing and the Internet of Things (IoT) are opening up entirely new possibilities for monitoring and threat prevention. At the same time, regulatory requirements for cybersecurity, functional safety and protection against tampering are becoming increasingly stringent.
Manufacturers of security technology need a partner who not only understands complex electronics, but can also industrialise them in accordance with international standards and ensure their long-term availability. BECOM brings all the necessary expertise together under one roof. As your long-term technology partner, we support you from the initial hardware concept through to reliable, process-controlled series production.
Safety-critical applications leave no room for hardware or software failures. Our engineering teams bring extensive experience in developing robust systems and prepare your products for the digital future.
We develop complex circuit designs and combine them with professional industrial design. This ensures that the electronics and enclosure are perfectly matched for efficient use of space and a high level of protection against external influences.
We develop stable, real-time embedded software and integrate modern artificial intelligence algorithms directly into the hardware (Edge AI). This enables fast, intelligent data and image processing directly on the device without delays caused by cloud connections.
Our development and manufacturing capabilities cover the full spectrum of modern building, personal and asset security. We manufacture electronic assemblies for the following key areas:
Access Control & Smart Locks: High-security electronic boards for biometric identification systems, RFID readers and intelligent, connected locking systems.
Video Surveillance & Edge AI: High-performance camera technology and computing platforms for high-resolution, real-time image analysis directly at the point of use.
Alarm Systems & Sensor Technology: High-availability detection systems, fire and intrusion detectors, and smart environmental sensors for early hazard detection.
Building Automation & Security Control Systems: Centralised, highly available control units that intelligently connect all security components within a building and incorporate appropriate safeguards against tampering.
Security electronics are often installed outdoors or exposed to severe mechanical stress. At our European production facilities, we use advanced EMS processes to provide long-term protection for your hardware:
Highly automated production lines process highly integrated components for compact smart locks just as reliably as robust power components for complex security control systems.
Through fully automated selective conformal coating or complete potting, we protect sensitive electronics against moisture, extreme temperatures and physical tampering or sabotage attempts.
We handle complete system assembly, including enclosure integration and cable harness assembly, delivering complete systems ready for control-cabinet installation or final mounting.
A failure in security technology can have serious consequences. That is why we rely on uncompromising in-line quality control using advanced 3D inspection methods:
3D SPI & 3D AOI: Three-dimensional in-line inspection of solder paste deposits and component placement to identify potential defects at an early stage and systematically reduce them.
3D X-Ray Inspection: Non-destructive X-ray inspection (AXI) for precise quality assessment of hidden solder joints beneath highly integrated Edge AI processors.
ICT / Flying Probe & EOL Functional Testing: Complete electrical verification of all conductive paths, followed by a final end-of-line functional test under real operating conditions, including comprehensive data logging for full traceability.
A failure in security technology can have serious consequences. To ensure consistently high manufacturing quality and reliable performance in the field, every electronic assembly at BECOM undergoes a strictly defined, multi-stage inspection process directly within the production line:
3D SPI (Solder Paste Inspection): Three-dimensional inspection of solder paste deposits to detect potential soldering defects before component placement.
3D AOI (Automated Optical Inspection): High-resolution optical inspection of component placement, polarity and solder joint geometry in three dimensions.
3D X-Ray Inspection: Non-destructive AXI inspection for reliable quality assessment of hidden solder joints beneath critical components such as highly integrated Edge AI processors.
ICT / Flying Probe: Comprehensive electrical in-circuit testing for complete verification of all conductive paths and component values.
EOL / Functional Testing (End-of-Line): Final, comprehensive functional testing of the complete system under real operating conditions, including precise test documentation and traceability.
Calibration: Precise adjustment and software calibration of integrated measurement and sensor components to ensure high and reproducible process accuracy in subsequent operation.
Security systems must demonstrate a high level of resistance to external interference and tampering attempts. At our accredited testing laboratory, we qualify your hardware and optimise the design to support the certification process:
EMC Testing: Verification of electromagnetic compatibility to support high resistance of your control systems to electromagnetic interference and potential sabotage-related disturbances.
Thermal Shock & Environmental Testing: Simulation of heat, freezing temperatures and humidity to verify reliable long-term operation of outdoor components.
Vibration & Mechanical Shock: Mechanical shock and ESD testing to assess resistance to vandalism and physical impact.