When electronic assemblies need to withstand heavy loads, last a long time or remain mechanically stable, through-hole assembly is often the right choice. BECOM manufactures through-hole assemblies with expertise, reliable processes and a clear focus on quality.
From connectors and power components to through-hole components with specific requirements, we integrate through-hole assembly reliably into the entire production process.
In through-hole assembly, the leads of components pass through the PCB and are soldered in place. This creates particularly strong mechanical connections suited to assemblies under heavy loads and demanding operating conditions.
BECOM manufactures through-hole assemblies for applications where stability, reliability and durability are essential, from mobility, automation and industrial electronics to Industry 4.0, security, healthcare, energy and IoT and IIoT applications.
Through-hole assembly requires experience, well-controlled processes and skilled teams. With leaded components, unusual shapes or parts subject to mechanical stress, the quality of every assembly step matters.
BECOM combines precision manual assembly with defined testing procedures. The result is assemblies that perform reliably even under demanding operating conditions.