Integrated EMS Expertise for Smart Connectivity
Developing IoT hardware requires the seamless interaction of highly efficient electronics and reliable connectivity. BECOM combines comprehensive engineering expertise for smart connected devices:
Smarte Elektronikfertigung für das Internet of Things (IoT / IIoT)
IoT / IIoT
IoT connects products, people and data. From intelligent sensors to connected industrial systems, new business models are emerging every day. BECOM develops and manufactures complete IoT products – from hardware and embedded software through to series production.
Your Experienced EMS Partner for Reliable Connectivity and Series Production
Increasing connectivity is transforming industries ranging from building automation to heavy industry. Today’s smart IoT and IIoT devices must become increasingly compact while maintaining reliable and stable communication over many years.
As an integrated EMS partner, BECOM bridges the gap between a smart idea and the physical product. We support you from the initial technological feasibility assessment and hardware design through to highly automated series production in Europe.
Wireless Technologies & Cloud Connectivity
We provide secure integration of modern wireless standards such as LoRaWAN, NB-IoT, LTE-M, BLE and Wi-Fi. We optimise the antenna design directly at PCB level and help ensure stable data transmission to your cloud systems.
Embedded OS & Gateway Development
Whether lean real-time operating systems (RTOS) for autonomous sensors or complex embedded Linux architectures for high-performance IoT gateways, our software teams develop stable, updateable and cybersecurity-focused firmware.
Smart Electronics Solutions for a Connected World
Our broad development and manufacturing capabilities cover the full spectrum of the Internet of Things. We develop and manufacture intelligent electronic assemblies for the following applications:
Smart Home & Smart Building: Connected control systems, intelligent actuators and user interfaces for modern buildings.
Smart City: Energy-efficient electronics for smart infrastructure, lighting systems and environmental monitoring stations.
Asset Tracking: Compact, battery-optimised GPS and wireless systems for the global tracking of goods and assets.
Edge Computing: High-performance hardware platforms for intelligent data preprocessing directly at the point of use.
Wireless Sensor Networks: Autonomous, connected sensor nodes for the continuous collection of environmental data.
Industrial IoT (IIoT): Robust communication modules and sensor technology for the smart factory automation of tomorrow.
Maximum Reliability Through Comprehensive Production Testing
IoT devices must operate reliably in the field over long periods with minimal maintenance. To ensure consistently high and reproducible manufacturing quality, every IoT assembly at BECOM undergoes a strictly defined, multi-stage inspection process directly within the production line:
3D SPI (Solder Paste Inspection): Three-dimensional inspection of solder paste deposits to detect potential soldering defects before component placement.
3D AOI (Automated Optical Inspection): High-resolution optical inspection of component placement, polarity and solder joint geometry in three dimensions.
3D X-Ray Inspection: Non-destructive AXI inspection for reliable quality assessment of hidden solder joints beneath highly integrated wireless and processor components.
ICT / Flying Probe: Comprehensive electrical in-circuit testing for complete verification of all conductive paths and component values.
EOL / Functional Testing (End-of-Line): Final, comprehensive functional testing of the complete system, including specific radio-frequency (RF) testing of the wireless interfaces.
Calibration: Precise adjustment and software calibration of integrated measurement and sensor components to ensure high accuracy in subsequent operation.
ISO/IEC 17025-Accredited Testing Laboratory for EMC and Environmental Testing
Smart wireless devices must neither interfere with other systems nor be susceptible to signal noise themselves. Across more than 1,000 m² of laboratory space, we support the development-stage qualification of your IoT hardware and optimise the design for final approval.
EMC Testing: Comprehensive testing of electromagnetic compatibility and radio compliance in modern semi-anechoic chambers to support reliable connectivity in global applications.
Thermal Shock & Environmental Testing: Simulation of extreme temperatures and humidity to ensure reliable long-term operation of outdoor sensors and trackers.
Vibration & Mechanical Shock: Mechanical shock and ESD testing to verify physical robustness under demanding day-to-day industrial operating conditions (IIoT).