Collage with impressions from the BECOM booth at Embedded World 2023 and presentations of innovative embedded system solutions.
21.03.2023

Embedded World 2023

Last week, Embedded World took place in Nuremberg.

Our experienced trade show team showcased the latest Embedded Systems developments with 3D Time-of-Flight technology:

  • Depth sensor solutions
  • Image processing
  • Embedded Vision
  • Multi-camera systems
  • Edge Computing
  • Deep Learning & AI

A definite highlight was the visual representation of our booth in 3D through our multi-camera systems, as well as a LIVE presentation on “Multi-Sensor Applications” by our Senior Business Development Manager, Mag.(FH) Tia Maria Troch.